Polymer Materials

Provide comprehensive product bonding and sealing solutions
Power Your Project Now!

Espark has accumulated rich development and application experience in emerging and traditional industries based on the development of various polymer materials, forming a technical system based on organic silicon, polyurethane, and epoxy resin, committed to providing customers with comprehensive product bonding and sealing solutions.
The adhesive product line includes sealants, sealing castables, structural adhesives, three proof coating adhesives, high-performance thermal conductive interface materials, etc. It is widely used in national pillar industries such as new energy vehicles, green electricity industry, intelligent manufacturing industrialization, and smart cities.

1 - Thermal conductive silicone ester

Product Model: EAW2805

High thermal conductivity insulating silicone material, with excellent electrical insulation, thermal conductivity, low degree of ionization (approaching zero), resistance to high and low temperatures, water, ozone, and climate aging.

Wide Applicability

The material is suitable for use as a critical heat transfer medium in heating elements and cooling facilities of various electronic products and electrical appliances.

Multi-functional Protection

It offers multiple protective properties such as moisture resistance, dustproofing, corrosion resistance, and shockproofing, safeguarding equipment from external environmental hazards.

Specialized for Microwave Devices

It is particularly suitable for the coating and potting of microwave communication, transmission equipment, and microwave-specific power supplies, enhancing the performance and stability of the devices.

2 - Single component high-temperature sealing insulation adhesive

Product Model: EAW2788

High end electronic adhesive, resistant to high temperatures, with excellent strength, toughness, and airtightness, truly achieves high adhesive sealing and has passed Foxconn testing.

High Sealing Performance

This material is used for sealing the USB Type-C interfaces produced by Foxconn for brands such as Huawei and Meizu. With its excellent sealing performance, it ensures the stability and durability of the interfaces in complex environments.

High-Purity Material

The sealing material is made from high-purity raw materials, which not only guarantees the excellent performance of the interface but also meets environmental protection requirements, providing strong assurance for the health and safety of users.

Passing Low-Halogen Detection

Strict testing by SGS has confirmed that this material meets low-halogen standards, further demonstrating its environmental performance and reassuring users during use.

3 - Single-component epoxy conductive silver paste

Product Model: EAW3705

Epoxy conductive adhesive can replace lead tin welding to achieve conductive connections.

Innovative Conductive Connection Solution

The single-component epoxy conductive silver paste serves as an innovative alternative to soldering wires on circuit boards, achieving conductive connections without the need for traditional lead-tin soldering. This simplifies the process flow, enhancing production efficiency.

Extensive Application Fields

This conductive silver paste is suitable for diverse fields such as microelectronics, ceramic capacitors, and mobile phone screens. Its excellent conductive performance and reliability meet the high-efficiency connection needs between different electronic components.

Outstanding Environmental Protection Advantages

The single-component epoxy conductive silver paste, made from environmentally friendly materials, replaces traditional lead-containing soldering materials, complying with environmental protection requirements and contributing to the sustainable development of the electronics industry.

This section doesn’t currently include any content. Add content to this section using the sidebar.